Samsung to build next-gen Qualcomm Snapdragon 835 SoC

(QTI), is launching its vulnerability rewards program created to expand collaboration with invited white hat hackers who improve the security of the Qualcomm Snapdragon family of processors, LTE modems and related technologies.

The US mobile giant, best known for its Snapdragon mobile processors that power numerous leading Android devices out today, has taken the wraps off its latest battery charging technology.

The Snapdragon 835 was crafted in collaboration with Samsung, and its major talking point is the 10-nanometer process node, which in layman’s terms means increased efficiency, or improved performance compared with previous Snapdragon chipsets.

First up is the reveal of the Snapdragon 835.

With Quick Charge 4, Qualcomm promises you’ll only need five minutes to get five hours of phone use.

The 10nm fabrication process allows mobile chips to deliver either 27 percent higher performance or 40 percent lower power consumption. For more than 30 years, Qualcomm ideas and inventions have driven the evolution of digital communications, linking people everywhere more closely to information, entertainment and each other.

USB Type-C and USB Power Delivery (USB PD) compliant.

Today, Qualcomm has announced its latest fast charging technology Quick Charge 4 in NY. The Snapdragon 820 was another product that was manufactured using Samsung’s 14nm process technology. There have been certain limitations around the latest USB connector when it comes to offering fast charging, but it seems like Qualcomm has made a decision to work around those.

If you plan to buy a premium smartphone next year, here’s an important detail: The handset may be equipped with Qualcomm’s next-generation Snapdragon 835 chip, which was announced on Thursday. Users can charge their devices up to 50 percent in 15 minutes. The new chip also brings the newest version of the company’s Quick Charge proprietary charging technology. Phones using the Snapdragon 835 will get three levels of current and voltage protection, as well as four levels of protection to stop overheating. That makes this chipset smaller than before, but more powerful and more energy efficient. The first devices are likely to be shown off at the CES technology fair in late January.